Dear Colleagues,
at COMPLAS 2025 – XVIII International Conference on Computational Plasticity. Fundamentals and Applications, to be held in Barcelona, Spain, on September 2-5 2025, we are organizing a mini-symposium entitled “Metal Fatigue And Elastoplasticity: Modeling And Applications” – CODE 603. The description of this mini-symposium is provided at the end of this message.
We are pleased to invite you to deliver a lecture in our invited mini-symposium. If you accept our invitation, please let us know asap and provide us with a preliminary title of your presentation.
Details regarding COMPLAS conference and guidelines for submitting your contribution, by March 1st 2025, can be found at the conference website: https://complas2025.cimne.com/
We are looking forward to hear from you and to meet you in Barcelona next September!
With our best regards,
Riccardo Fincato & Valentina Salomoni
University of Padova, Italy
603 – Metal Fatigue And Elastoplasticity: Modeling And Applications
Fatigue is a complex phenomenon resulting from the interaction of various factors, including microstructural effects, thermal influences, irreversible deformation, geometry, and loading conditions. Developing a methodology or model to predict material behavior remains a critical challenge, as fatigue is responsible for approximately 80% of component and structural failures caused by fracture. The significance of plastic deformations has been demonstrated not only in low-cycle fatigue conditions but also in high-cycle and very high-cycle fatigue scenarios. Despite advances in computational capabilities, accurately modeling fatigue remains challenging due to the high number of loading cycles, the multitude of influencing factors, and the heterogeneity of material properties, particularly in cases such as welded joints. Therefore, the aim of this section is to present ongoing research on modeling the fatigue phenomenon through numerical simulations, highlighting improvements in predictive accuracy, innovative approaches for service life estimation, crack growth modeling, and techniques for reducing computational time.
